What is the difference between ENIG and Enepig?

What is the difference between ENIG and Enepig?

ENEPIG is similar to ENIG in both utilize electro-less nickel on top of copper plating; the difference is while ENIG has gold deposited directly on top of nickel, ENEPIG has an additional layer of palladium between the nickel and final gold layer (see below Fig.

What is Enepig plating?

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a type of surface plating applied on a Printed Circuit Board to protect it from environmental factors during storage and operation.

Can you wire bond to ENIG?

ENIG is an ideal surface for aluminum wire bonding. However, with only 2- 4 micro-inches of gold it is not suitable for gold wire bonding. Soft gold at 10 – 25 micro-inches is needed for successful gold wire bonding.

What is Enepig surface finish?

ENEPIG is a type of metal plating for PCBs. Developed around a decade ago, this kind of surface finish has gained popularity in recent years for its comparatively low cost to other types of gold plating for PCBs. Over the past several years, prices for palladium have substantially decreased compared to gold.

Is Enepig lead-free?

ENEPIG came through with flying colors as it formed one of the most robust solder joints with lead-free SAC type alloys.

What is ENIG finish PCB?

Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

How thick is ENIG finish?

between 0.05 to 0.23 µm
ENIG plating thickness of each layer should be between 0.05 to 0.23 µm for the immersion gold layer and 2.5 to 5.0 µm for the electroless nickel. The thicker the immersion gold layer, the more likely it is to result with a black pad due to process complications.

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